Copper Foam Heat Sink

The lph00xx series of micro porous copper and foam heatsinks from versarien use homogenously distributed interconnected pores to present a large surface area for enhanced heat dissipation.

Copper foam heat sink.

The combination of surface area and the thermal conductivity properties of copper enable the height of these heatsinks to be markedly reduced without sacrificing operational performance levels. For a 20x20x5 mm heat sink the thermal resistance is 35 8 c w for an applied load of 2w. Get it as soon as thu sep 3. For example the thermal resistance of a 40x40x5 mm micro porous copper foam heat sink is 17 4 c w for an applied load of 5w.

This testing compares a constant heat sink geometry made from copper aluminum and graphite foam. Copper oxide coated foam heat sinks microporous copper foam coated with a thin hard layer of copper oxide provides outstanding performance as a low profile heat sink in passive cooling environments. Conventional heat sinks require special appendages such as pins fins or micro channels to increase their surface area. In this particular experimental analysis copper foam based heat sink is considered for analysis without pcm and with four different pcms i e.

From us you can easily purchase copper foam heat absorbing materials at great prices. Versarien low profile metallic foam heat sinks are designed for use in passive cooling applications where space is at a premium and performance is crucial. Next an application specific heat sink study is presented using computational fluid dynamics cfd software. In this study a heat sink was designed in 3d cad to cool a dual core host processor.

The underlying microporous copper foam structure of the heat sinks has pore sizes between 300 and 600 microns and a relative density of around 37 providing a much higher surface area than traditional copper foams. Place online order and we will dispatch your order through dhl fedex ups. Pastall 100 pcs 8 different sizes heatsink kit with conductive adhesive tape aluminum heat sink cooler and copper heatsink for raspberry pi a b b 2 3 4. As an example of this technology for use in a heatsink a layer of copper foam was bonded to a copper plate using thermal epoxy.

A thin hard layer of high temperature copper oxide improves the emissivity of the foam boosting the radiant properties of the heat sink and reducing the temperature of the component. The pressure drop crossing the copper foam heat sink increases with the increase in pore density and decrease in porosity. The copper plate has a number of holes to enhance airflow through the foam lateral flow through a large cross section falls off quickly due to its dense nature. The performance of both an aluminum and copper design was then evaluated using cfd.

Rt 35hc rt 44hc rt 54hc and paraffin wax having melting ranges varying from 34 c to 57 c for suitable heating load ranging from 0 8 to 2 4 kw m2.